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Your search returned 14 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1998 Volume number : 21 Issue: 01 |
Efficient Transient Simulation Of High-Speed Interconnects Characterized By Sampled Data
(Article)
Subject:
High-Speed Interconnect
,
Rational Approximation
,
Scattering Parameters
Author:
Wendemagegnehu T
Beyene
J. E
Schutt-Aine
page:
105
-
114
Three-Dimensional Memory Module
(Article)
Subject:
Cost Of Fabrication
,
Packaging
,
Fabrication
Author:
Nobuaki
Takahashi
Kenichi
Tokuno
Shimada
Yuzo
page:
15
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A Review Of 3-D Packaging Technology
(Article)
Subject:
3-D Model Of The Stitch
,
Bare Dice Stacking
Author:
S. F.
Al-Sarawi
Derek
Abbott
Paul D.
Franzon
page:
2
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14
A High Peformance Mcm-D/C Application
(Article)
Subject:
Cooling
,
Flip Chip
,
Mcmc
,
Reliability
Author:
Eric D.
Perfecto
Hai P.
Longworth
Roy
Yu
page:
20
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27
Molded Chip Scale Package For High Pin Count
(Article)
Subject:
Chip Scale Package
,
Known-Good-Yield
,
Robust Parameter Design
Author:
Shinji
Baba
Yoshihiro
Tomita
Takashi
Matsushima
page:
28
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34
Electrical Design Of A Cost-Effective Thermal Enhanced Plastic Ball Grid Array Package-Nubga
(Article)
Subject:
Cost-Effective
,
Electrical Engineering
,
Svc
Author:
John H.
Lau
Tai-Yu
Chou
page:
35
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42
New Design For A Lead Frame Used For High Pin Counts And High-Power Lsi Package
(Article)
Subject:
Flexible Couplings
,
Lead-Ffree
,
Lsi
Author:
Mamoru
Mita
Shoji
Takagi
Hiroki
Tanaka
page:
43
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52
Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration
(Article)
Subject:
First Law
,
Finite - Element Analysis
,
Prototyping
Author:
Qing
Tan
Brian
Schaible
Leonard J.
Bond
page:
53
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58
Material Interactions Of Solder Bumps Produced With Fluxless Wave Soldering
(Article)
Subject:
Diffusion
,
Solder Bump Radius
,
Wave Setup
Author:
Kwang -Lung
Lin
Wen-Hsiuan
Chao
page:
59
-
64
Material Interactions Of Solder Bumps Produced With Fluxless Wave Soldering
(Article)
Subject:
Diffusion Barriers
,
Wave Scattering
,
Wave Setup
Author:
Kwang Lung
Lin
Wen-Hsiuan
Chao
page:
59
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64
A Three-Dimensional Modeling Of Wire Sweep Incorporating Resin Cure
(Article)
Subject:
Resin
,
3-D Model Of The Stitch
,
Wire Edm
Author:
J H
Wu
A. A. O.
Tay
T.B.
Lim
page:
65
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72
Multicriteria Decision Making In Design Of Printed Wire Boards
(Article)
Subject:
Design Thinking
,
Multiobjective Programming
,
Weighting Function
Author:
Yesim
Tokat
Ferenc
Szidarovszky
Olgierd A.
Patusinski
page:
73
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78
Investigation Of Interfacial Fracture Behavior Of A Flip-Chip Package Under A Constant Concentrated Load
(Article)
Subject:
Crack Growth
,
Energy Release Rate
,
Finite Element Analysis
Author:
Jianjun
Wang
Shengyi
Liu
Daqing
Zou
page:
79
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86
Thermomechanical Analysis In Electronic Packaging With Unified Constitutive Model For Materials And Joints
(Article)
Subject:
Calibration Chamber
,
Chip-Level Receivers
,
Finite - Element Analysis
Author:
Chandra S
Desai
Cemal
Basaran
Burl E
Dishongh
page:
87
-
97
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