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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1998 Volume number : 21 Issue: 01

Efficient Transient Simulation Of High-Speed Interconnects Characterized By Sampled Data (Article)
Subject: High-Speed Interconnect , Rational Approximation , Scattering Parameters
Author: Wendemagegnehu T Beyene      J. E Schutt-Aine     
page:      105 - 114
Three-Dimensional Memory Module (Article)
Subject: Cost Of Fabrication , Packaging , Fabrication
Author: Nobuaki Takahashi      Kenichi Tokuno      Shimada Yuzo     
page:      15 - -
A Review Of 3-D Packaging Technology (Article)
Subject: 3-D Model Of The Stitch , Bare Dice Stacking
Author: S. F. Al-Sarawi      Derek Abbott      Paul D. Franzon     
page:      2 - 14
A High Peformance Mcm-D/C Application (Article)
Subject: Cooling , Flip Chip , Mcmc , Reliability
Author: Eric D. Perfecto      Hai P. Longworth      Roy Yu     
page:      20 - 27
Molded Chip Scale Package For High Pin Count (Article)
Subject: Chip Scale Package , Known-Good-Yield , Robust Parameter Design
Author: Shinji Baba      Yoshihiro Tomita      Takashi Matsushima     
page:      28 - 34
Electrical Design Of A Cost-Effective Thermal Enhanced Plastic Ball Grid Array Package-Nubga (Article)
Subject: Cost-Effective , Electrical Engineering , Svc
Author: John H. Lau      Tai-Yu Chou     
page:      35 - 42
New Design For A Lead Frame Used For High Pin Counts And High-Power Lsi Package (Article)
Subject: Flexible Couplings , Lead-Ffree , Lsi
Author: Mamoru Mita      Shoji Takagi      Hiroki Tanaka     
page:      43 - 52
Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration (Article)
Subject: First Law , Finite - Element Analysis , Prototyping
Author: Qing Tan      Brian Schaible      Leonard J. Bond     
page:      53 - 58
Material Interactions Of Solder Bumps Produced With Fluxless Wave Soldering (Article)
Subject: Diffusion , Solder Bump Radius , Wave Setup
Author: Kwang -Lung Lin      Wen-Hsiuan Chao     
page:      59 - 64
Material Interactions Of Solder Bumps Produced With Fluxless Wave Soldering (Article)
Subject: Diffusion Barriers , Wave Scattering , Wave Setup
Author: Kwang Lung Lin      Wen-Hsiuan Chao     
page:      59 - 64
A Three-Dimensional Modeling Of Wire Sweep Incorporating Resin Cure (Article)
Subject: Resin , 3-D Model Of The Stitch , Wire Edm
Author: J H Wu      A. A. O. Tay      T.B. Lim     
page:      65 - 72
Multicriteria Decision Making In Design Of Printed Wire Boards (Article)
Subject: Design Thinking , Multiobjective Programming , Weighting Function
Author: Yesim Tokat      Ferenc Szidarovszky      Olgierd A. Patusinski     
page:      73 - 78
Investigation Of Interfacial Fracture Behavior Of A Flip-Chip Package Under A Constant Concentrated Load (Article)
Subject: Crack Growth , Energy Release Rate , Finite Element Analysis
Author: Jianjun Wang      Shengyi Liu      Daqing Zou     
page:      79 - 86
Thermomechanical Analysis In Electronic Packaging With Unified Constitutive Model For Materials And Joints (Article)
Subject: Calibration Chamber , Chip-Level Receivers , Finite - Element Analysis
Author: Chandra S Desai      Cemal Basaran      Burl E Dishongh     
page:      87 - 97